Key Trends Shaping the Semiconductor Plating System Market
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The Global
Semiconductor Plating System Market, valued at US$ 5.1 billion in 2022, is
anticipated to grow at a compound annual growth rate (CAGR) of 4.8% from 2023
to 2031, reaching a valuation of US$ 7.7 billion by the end of 2031.
The increasing usage
of electronic components in the automotive sector and the growing global demand
for semiconductors are key factors driving market development. Semiconductor
plating enhances the solderability of substrates, protects against wear, and
improves corrosion resistance and electrical conductivity.
Leading
manufacturers are focusing on designing advanced products to improve plating
technology performance. Growth strategies such as collaborations, mergers and
acquisitions, product launches, and the development of worldwide distribution
networks are helping companies capitalize on lucrative semiconductor plating
system opportunities.
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Market Introduction
The semiconductor
industry predominantly manufactures chips from silicon plated with materials
like gold, copper, and silver to ensure product quality. The rising use of
semiconductor components in automobiles and connected devices is positively
impacting the performance of semiconductor components.
Copper plating is
gaining popularity due to the industry's shift towards complex packaging
systems. Copper plating solutions are favored for their outstanding
coplanarity, low deposit roughness, and high-speed plating. Semiconductor plating
systems include fully automatic, semi-automatic, and manual types.
Increase in Usage of Electronic Components in the
Automotive Sector
The automotive
sector is rapidly growing, with increasing demand for fuel-efficient,
autonomous, and technologically advanced vehicles in both developing and
developed countries. Modern vehicles feature heads-up displays, mobile phone
integration, and autonomous driving aids, pushing consumers towards vehicles
with enhanced comfort and performance.
Key automotive
manufacturers are developing electric vehicles with advanced electronics,
leading to increased demand for automotive semiconductors and, consequently,
semiconductor plating systems. Electric vehicle production is expected to rise
globally, with India's electric vehicle market projected to reach US$ 7.1
billion by 2025 and US$ 206.0 billion by 2030, further boosting demand for
semiconductor plating systems.
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Growth in Demand for Semiconductors Augmenting Market
Statistics
Semiconductors are
increasingly used in consumer electronics such as microwaves, refrigerators,
computers, mobile phones, and gaming consoles. They are vital components in
embedded systems, enabling products like central heating systems, GPS systems,
fitness trackers, and televisions.
The emergence of
Internet of Things (IoT) and Artificial Intelligence (AI) technologies is
creating lucrative opportunities for manufacturers in the semiconductor plating
system market.
High Demand for
Fully Automatic Semiconductor Plating Systems
Fully automatic
semiconductor plating systems accounted for 39.1% market share in 2022 and are
projected to dominate during the forecast period. These systems are powerful,
cost-efficient, easy to use, and designed for electrochemical deposition (ECD)
and surface preparation wet processing, particularly for ≤200 mm wafers.
Surge in Adoption of Electroplating Technology
Electroplating
technology held 57.2% of the market share in 2022 and is expected to lead
during the forecast period, driven by the expansion of the electronics industry
and the demand for cost-effective and sustainable semiconductor plating
technologies.
Regional Outlook of
the Global Semiconductor Plating System Industry
Asia Pacific held a
prominent market share of 46.8% in 2022, expected to continue dominating due to
the strong presence of semiconductor manufacturers in the region. North
America's market size is anticipated to increase steadily, supported by
government initiatives for the semiconductor sector.
Analysis of Key Players
The global
semiconductor plating system market is consolidated, with major companies
controlling a significant share. Leading players are investing in R&D,
expanding product portfolios, and pursuing mergers and acquisitions to
capitalize on market opportunities.
Key players include
ACM Research, Inc., Applied Materials, Inc, ASMPT, ClassOne Technology, Inc.,
EBARA Technologies, Inc., Hitachi Power Solutions Co., Ltd., LAM RESEARCH
CORPORATION, MITOMO SEMICON ENGINEERING CO., LTD., RENA Technologies, and
TANAKA HOLDINGS Co., Ltd.
Key Developments
- ACM Research, Inc.: In May 2022, ACM
Research received a contract from China-based OSAT for 10 Ultra ECP ap
high-speed plating tools, previously used by OSAT customers for advanced
WLP applications.
- ClassOne Technology, Inc.: In March
2021, ClassOne Technology received a repeat order of the Solstice S8
Electroplating System from i3 Microsystems. The system includes the
proprietary CopperMax chamber for advanced copper plating and handles
several surface preparation functions.
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