Glass Wafer Carrier Market Outlook: Opportunities in Automotive and Telecommunications
The glass
wafer carrier market is experiencing robust growth, driven by
advancements in semiconductor manufacturing and increasing demand from
industries like automotive, telecommunications, and consumer electronics.
Valued at US$ 551.1 million in 2023, the market is projected to grow at
a CAGR of 19.2% from 2024 to 2031, reaching US$ 2.2 billion by 2031.
This strong growth trajectory is a result of several converging factors,
including the need for high-performance components in microelectronics,
increasing focus on automotive safety systems, and the rise of connected and
wearable devices.
The demand for glass wafer carriers is being
propelled by the automotive and IT & telecommunications sectors,
which rely heavily on semiconductor devices. As vehicle safety features
such as Advanced Driver Assistance Systems (ADAS) and infotainment
continue to evolve, the need for semiconductor components in the automotive
industry is growing. Additionally, the adoption of 5G technology and increased
use of wireless devices are boosting demand for MEMS sensors and
other microelectronics that require high-quality wafer carriers.
Key players in the market are focusing on improving the
quality, performance, and sustainability of glass wafer carriers to meet
the rising demand across industries, which further supports the market’s
expansion.
Glass wafer carriers are specially designed discs
made from high-performance materials such as borosilicate and
alumino-borosilicate glass. These materials offer high thermal expansion
properties, superior transmittance, and excellent resistance to
temperature-induced deformation. Glass wafer carriers are critical in
semiconductor manufacturing, providing mechanical stability to wafers
during processing, which ensures integrity and reliability in the
final product.
The stability of the glass minimizes mechanical
stress, which is particularly important for microelectronic devices,
especially those used in automotive safety systems and telecommunications.
Additionally, these carriers are reusable, contributing to the sustainability
of the manufacturing process by lowering production costs and reducing material
waste.
Key Market Drivers
1. High Demand for Semiconductor Packaging
One of the primary factors driving the glass wafer
carrier market is the growing demand for semiconductor packaging. Wafer-level
packaging (WLP) has become increasingly popular due to its ability to offer
compact, high-performance solutions at lower costs. Glass wafer carriers
are critical for this technology, providing the necessary substrate for MEMS
(Micro-Electro-Mechanical Systems), CIS (CMOS Image Sensors), and
other semiconductor devices.
The demand for MEMS and CIS in industries such
as automotive, healthcare, and consumer electronics is further
accelerating the demand for glass wafer carriers. The Wafer-Level Capping
(WL Capping) process, which involves using glass as a carrier substrate, is
driving the need for high-quality glass materials. Companies like SCHOTT
are contributing to this market shift by providing glass carriers for advanced
packaging processes.
2. Rise in Demand for MEMS in Automotive Industry
The automotive sector’s increasing reliance on MEMS
sensors is significantly impacting the glass wafer carrier market. MEMS
sensors are essential for tire pressure monitoring, oil pressure
sensing, collision avoidance, and navigation systems.
Governments across the globe are imposing stricter standards
and regulations to improve vehicle safety and reduce emissions, further
driving the demand for MEMS sensors. In countries like India, the automotive
market is expanding rapidly, and MEMS sensors are becoming increasingly
critical in passenger vehicles and commercial trucks. With rising
demand for MEMS in safety and convenience features, the glass wafer
carrier market is expected to witness substantial growth.
3. High Demand for Borosilicate Glass
Among the different types of glass used in wafer carriers, borosilicate
glass holds the largest share of the market due to its durability,
thermal stability, and low cost. Borosilicate glass is widely used
in semiconductor devices, optical filters, optical lenses, and sensors
due to its superior performance characteristics.
The segment accounted for 48.1% of the market share in
2023 and is expected to grow at a rate of 20.1% during the forecast
period. In March 2023, SCHOTT AG invested €75 million in
expanding its borosilicate glass production capacity in India to meet
rising demand in semiconductors and consumer electronics.
4. Up to 100mm Wafer Diameter Gaining Traction
The up to 100mm wafer diameter segment is anticipated
to continue its dominance in the market, driven by demand from the consumer
electronics sector. These wafers are commonly used in optoelectronics
devices and MEMS circuits. With rising demand from the semiconductor
and electronics industries, manufacturers are innovating to meet this
growing need.
For example, WaferPro launched the 4” (100mm)
Borofloat Glass Wafer, offering excellent thermal properties, chemical
resistance, and mechanical stability for various applications. This
product supports the high-quality demands of semiconductor and electronics
sectors.
Regional Outlook
Asia Pacific Leads the Glass Wafer Carrier Market
Asia Pacific is the leading region in the glass wafer
carrier market, accounting for 43.9% of the global market share in 2023.
The region is home to major semiconductor manufacturing hubs, including China,
South Korea, Taiwan, and Japan. These countries are
significant players in the electronics and automotive industries,
driving demand for glass wafer carriers.
China’s rapid growth in semiconductor production and
its expanding electronics manufacturing are major contributors to the
region’s growth. The growing middle class and rising disposable
income in countries like India further fuel demand for consumer
electronics and automotive devices, creating lucrative opportunities for the
glass wafer carrier market.
Key Players and Market Developments
The global glass wafer carrier market is moderately
consolidated, with leading companies focusing on product innovation, expansion
of manufacturing facilities, and strategic partnerships. Key players
include:
- SCHOTT
AG
- Corning
Incorporated
- Nippon
Electric Glass (NEG)
- OHARA
- AGC
Inc.
Recent Developments
- January
2023: SCHOTT Korea started supplying glass carrier wafers
for packaging processes to global semiconductor manufacturers.
- June
2022: Corning Incorporated launched ultra-low TTV glass
carrier wafers for 5G connectivity applications, allowing for better
process control in semiconductor packaging.
Conclusion
The glass wafer carrier market is undergoing
significant expansion, driven by growth in automotive electronics, telecommunications,
consumer electronics, and semiconductor packaging. With a CAGR
of 19.2%, the market is poised to reach US$ 2.2 billion by 2031,
supported by technological advancements, regulatory requirements, and
increasing demand for MEMS sensors and connected devices.
As Asia Pacific leads the way, companies are focusing
on borosilicate glass innovations, miniaturization, and advanced
packaging technologies to capitalize on the booming demand for
semiconductor devices across industries.
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